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Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks

ASML Holding NV has won commitments from top chipmakers to use its latest semiconductor production gear, while embarking …

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In this story ASML High NA EUV Intel Samsung TSMC

Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks

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Bloomberg — Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks ↗

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CNBC: CNBC

Reuters: Reuters

Samsung Newsroom: Samsung Newsroom

ASML: ASML

Wccftech: Wccftech

Phoenix Business Journal: Phoenix Business Journal

Chip Briefing: Chip Briefing

The Register: The Register

Discussion

Marco Pieters Ashish Nadkarni Christophe Fouquet Sarah Jacob

@tculpan @bamabonds @intellionaire @asmlcompany @aschilling

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